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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/25 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 serial eeprom series standard eeprom wlcsp eeprom BRCF016GWZ-3 general description BRCF016GWZ-3 is a serial eeprom of i 2 c bus interface method features ? completely conforming to the world standard i 2 c bus. all controls available by 2 ports of serial clock (scl) and serial data (sda) ? 1.7v to 5.5v single power source operation most suitable for battery use ? 1mhz action is possible(1.7v to 5.5v) ? up to 16 bytes in page write mode ? self-timed programming cycle ? low current consumption ? prevention of write mistake at low voltage ? more than 1 million write cycles ? more than 40 years data retention ? noise filter built in scl / sda terminal ? initial delivery state ffh ucsp30l1 0.86mm x 0.84mm x 0.35mm BRCF016GWZ-3 capacity bit format type power source voltage package 16kbit 2k8 BRCF016GWZ-3 1.7v to 5.5v ucsp30l1 package w (typ) x d(typ) x h(max) downloaded from: http:///
datasheet 2/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 absolute maximum ratings (ta=25c) parameter symbol rating unit remark supply voltage v cc -0.3 to +6.5 v power dissipation pd 0.22 (ucsp30l1) w decrease by 2.2mw/c when operating above ta=25c storage temperature tstg -65 to +125 c operating temperature topr -40 to +85 c input voltage/ output voltage \ -0.3 to vcc+1.0 v the max value of input voltage / output voltage is not over 6.5v. when the pulse width is 50ns or less, the min value of input voltage / output voltage is not lower than -1.0v. junction temperature tjmax 150 c junction temperature at the storage condition electrostatic discharge voltage(human body model) v esd -4000 to +4000 v memory cell characteristics (ta=25 , vcc=1.7v to 5.5v) parameter limit unit min typ max write cycles (1) 1,000,000 - - times data retention (1) 40 - - years (1)not 100% tested recommended operating ratings parameter symbol rating unit power source voltage vcc 1.7 to 5.5 v input voltage v in 0 to vcc dc characteristics ( unless otherwise specified, ta=-40 to +85 , vcc=1.7v to 5.5v ) parameter symbol limit unit conditions min typ max input high voltage v ih 0.7vcc - vcc+1.0 v 1.7v vcc 5.5v input low voltage v il -0.3 (2) - +0.3vcc v 1.7v vcc 5.5v output low voltage1 v ol1 - - 0.4 v i ol =3.0ma, 2.5v vcc 5.5v (sda) output low voltage2 v ol2 - - 0.2 v i ol =0.7ma, 1.7v vcc 2.5v (sda) input leakage current i li -1 - +1 a v in =0 to vcc output leakage current i lo -1 - +1 a v out =0 to vcc (sda) supply current (write) i cc1 - - 2.0 ma vcc=5.5v, f scl =1mhz, t wr =5ms, byte write, page write supply current (read) i cc2 - - 2.0 ma vcc=5.5v, f scl =1mhz random read, current read, sequential read standby current i sb - - 2.0 a vcc=5.5v, sda ? scl=vcc (2) when the pulse width is 50ns or less, it is -1.0v. downloaded from: http:///
datasheet 3/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 ac characteristics (unless otherwise specified, ta=-40 to +85 , vcc=1.7v to 5.5v) parameter symbol limi t s 1.7v Q vcc Q 5.5v unit min typ max clock frequency f scl - - 1000 khz data clock high period t high 0.3 - - s data clock low period t low 0.5 - - s sda and scl rise time (1) t r - - 0.12 s sda and scl (input)fall time (1) t f1 - - 0.12 s sda(output) fall time (1) t f2 - - 0.12 s start condition hold time t hd:sta 0.25 - - s start condition setup time t su:sta 0.20 - - s input data hold time t hd:dat 0 - - ns input data setup time t su:dat 50 - - ns output data delay time t pd 0.05 - 0.45 s output data hold time t dh 0.05 - - s stop condition setup time t su:sto 0.25 - - s bus free time t buf 0.5 - - s write cycle time t wr - - 5 ms noise spike width (sda and scl) t i - - 0.05 s (1) not 100% tested. condition input data level: v il =0.2vcc v ih =0.8vcc input data timing reference level: 0.3vcc/0.7vcc output data timing reference level: 0.3vcc/0.7vcc rise/fall time: 20ns serial input / output timing input read at the rise edge of scl data output in sync with the fall of scl figure 1-(a). serial input / output timing figure 1-(b). start-stop bit timing figure 1-(c). write cycle timing scl sda (input) sda (output) tr tf thigh tsu:dat tlow thd:dat tdh tpd tbuf 70% 70% 30% 70% 70% 30% 30% 70% 70% 30% 70% 70% 70% 70% 30% 30% 30% 70% 70% tsu:sta thd:sta tt iti tsu:sto t iti 30% 30% 70% 70% sda (input) scl d0 ack twr (n-th address) tt iti t iti 70% 70% scl sda (input) downloaded from: http:///
datasheet 4/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 block diagram figure 2. block diagram pin configuration figure 3. pin configuration (bottom view) pin descriptions land no. terminal name input / output descriptions b2 sda input / output slave and word address serial data input and serial data output b1 scl input serial clock input a2 gnd - reference voltage of all input / output a1 vcc - power supply g sda scl vcc 8kbit eeprom array address deco der slave word address register dat a reg ist er c ontro l lo g ic high voltage gen vcc level detect 10bit 8bit ac k st a r t s t o p 10bit gnd vcc 16kbit eeprom array 11bit 11bit downloaded from: http:///
datasheet 5/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 6. output low voltage1 vs output low current (vcc=2.5v) figure 7. output low voltage2 vs output low current (vcc=1.6v) figure 4. input high voltage vs supply voltage figure 5. input low voltage vs supply voltage typical performance curves 0 0.2 0.4 0.6 0.8 1 0123456 output low current: i ol (m a) output low voltage1: v ol1 (v) spec ta= -40c ta= 25c ta= 85c 0 0.2 0.4 0.6 0.8 1 0123456 output low current: i ol (m a) output low voltage2: v ol2 (v) spec ta= -40c ta= 25c ta= 85c 0 1 2 3 4 5 6 0123456 supply voltage: vcc(v) input low voltage: v il (v) spec ta=-40c ta= 25c ta= 85c 0 1 2 3 4 5 6 0123456 supply voltage: vcc(v) input high voltage : v ih (v) ta=- 40c ta= 25c ta= 85c spec downloaded from: http:///
datasheet 6/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 11. supply current (read) vs supply voltage (f scl =1mhz) figure 8. input leakage current vs supply voltage (scl) figure 9. output leakage current vs supply voltage (sda) figure 10. supply current (write) vs supply voltage (f scl =1mhz) typical performance curves \ continued 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) input leakage current: i li ( a) spec ta= -40c ta= 25c ta= 85c 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) output leakage current: i lo (a) ta=-40 ta= 25 ta= 85 spec 0 0.5 1 1.5 2 2.5 3 0123456 supply voltage : vcc(v) supply current (write) : icc1(ma) ta=-40 ta= 25 ta= 85 spec 0 0.5 1 1.5 2 2.5 0123456 supply voltage : vcc(v) supply current (read) : i cc2 (ma) t= t= t= downloaded from: http:///
datasheet 7/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 13. clock frequency vs supply voltage figure 14. data clock high period vs supply voltage figure 12. standby current vs supply voltage figure 15. data clock low period vs supply voltage typical performance curves \ continued 0 0.5 1 1.5 2 2.5 0123456 supply voltage: vcc(v) standby current: i sb (a) spec ta= -40c ta= 25c ta= 85c 0.1 1 10 100 1000 10000 0123456 supply voltage: vcc(v) clock frequency: f scl (khz) spec ta=-40c ta= 25c ta= 85c 0 0.1 0.2 0.3 0.4 0123456 supply voltage : vcc(v) data clock high period : t high (s) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0.6 supply voltage : vcc(v) data clock low period : t low (s) t= t= t= downloaded from: http:///
datasheet 8/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 18. start condition setup time vs supply voltage figure 19. input data hold time vs supply voltage (high) figure 16. sda (output) fall time vs supply voltage figure 17. start condition hold time vs supply voltage typical performance curves \ continued 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 supply voltage : vcc(v) sda (output) fall time : t f2 (s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 supply voltage : vcc(v) start condition hold time : t hd:sta (s) t= t= t= 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0123456 supply voltage : vcc(v) start condition setup time : t su:sta (s) t= t= t= -150 -100 -50 0 50 0123456 supply voltage: vcc(v) input data hold time : t hd:dat (ns) t= t= t= downloaded from: http:///
datasheet 9/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 20. input data hold time vs supply voltage (low) figure 22. input data setup time vs supply voltage (low) figure 23. output data delay time vs supply voltage ( low ) figure 21. input data setup time vs supply voltage (high) typical performance curves \ continued -150 -100 -50 0 50 0123456 supply voltage : vcc(v) input data hold time : t hd:dat (ns) t= t= t= 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) t= t= t= 0 10 20 30 40 50 60 0123456 supply voltage : vcc(v) input data setup time : t su:dat (ns) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd0 (s) t= t= t= downloaded from: http:///
datasheet 10/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 24. output data delay time vs supply voltage ( high ) figure 25. stop condition setup time vs supply voltage figure 26. bus free time vs supply voltage figure 27. write cycle time vs supply voltage typical performance curves \ continued 0 0.1 0.2 0.3 0.4 0.5 0123456 supply voltage : vcc(v) output data delay time : t pd1 (s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) stop condition setup time : t su:sto (s) t= t= t= 0 0.1 0.2 0.3 0.4 0.5 0.6 su p p l y vo l ta g e : vcc(v) bus free time : t buf (s) t= t= t= 0 1 2 3 4 5 6 0123456 supply voltage : vcc(v) write cycle time : t wr (ms) ta=-40 ta= 25 ta= 85 spec downloaded from: http:///
datasheet 11/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 figure 28. noise spike width vs supply voltage (scl high) figure 30. noise spike width vs supply voltage (sda high) figure 31. sda noise spike width (low) vs supply voltage (sda low) figure 29. noise spike width vs supply voltage (scl low) typical performance curves \ continued 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl high) : ti(s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(scl low) : ti(s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike width(sda high) : t i (s) t= t= t= 0 0.05 0.1 0.15 0.2 0.25 0.3 0123456 supply voltage : vcc(v) noise spike widthi(sda low) : t(s) t= t= t= downloaded from: http:///
datasheet 12/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 timing chart 1. i 2 c bus data communication i 2 c bus data communication starts by start condition input, and e nds by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with several devices is possible by connecting with 2 communication lines; serial data (sda) and serial clock (scl). among the devices, there should be a ma ster that generates clock and control communication start and end. the rest become slave which is controlled by an address peculiar to each device lik e this eeprom. the device that outputs data to the bus during data communication is called transmitter, and the device that receives data is called receiver. 2. start condition (start bit recognition) (1) before executing each command, start condition (start bit) where sda goes from 'high' down to 'low' when scl is 'high' is necessary. (2) this ic always detects whether sda and scl are in start co ndition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. stop condition (stop bit recognition ) (1) each command can be ended by a stop condition (stop bit) where sda goes from 'low' to 'high' while scl is 'high'. 4. acknowledge (ack) signal (1) this acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in a master and slave communication, the device (ex. -com sends slave address input for write or read command to this ic) at the transmitter (sending) side releases the bus after output of 8bit data. (2) the device (ex. this ic receives the slave address input for write or read command from the -com) at the receiver (receiving) side sets sda 'low' during the 9th clock cycle, and outputs acknowledge signal (ack signal) showing that it has received the 8bit data. (3) this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) 'low'. (4) after receiving 8bit data (word address and write data) during each write operation, th is ic outputs acknowledge signal (ack signal) 'low'. (5) during read operation, this ic outputs 8bit data (read da ta), and detects acknowledge signal (ack signal) 'low'. when acknowledge signal (ack signal) is detected, and st op condition is not sent from the master (-com) side, this ic continues to output data. when acknowledge signal (ack signal) is not detected, this ic stops data transfer, recognizes stop condition (stop bi t), and ends read operation. then th is ic becomes ready for another transmission. 5. device addressing (1) slave address comes after start condition from master. (2) the significant 4 bits of slave address are used for recognizing a device type. the device code of this ic is fixed to '1010'. (3) the most insignificant bit ( w/r --- read / write ) of slave address is used for designating write or read operation, and is as shown below. setting w/r to 0 ------- write (setting 0 to word address setting of random read) setting w/r to 1 ------- read type slave address BRCF016GWZ-3 1 0 1 0 p2 p1 p0 r/w DD p0~p2 are page select bits. t t t tt figure 32. data transfer timing downloaded from: http:///
datasheet 13/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 write command 1. write cycle (1) arbitrary data can be written to this eeprom. when wr iting only 1 byte, byte write is normally used, and when writing continuous data of 2 bytes or more, simultaneous wr ite is possible by page write cycle. up to 16 arbitrary bytes can be written. (2) during internal write execution, all input commands are ignored, theref ore ack is not returned. (3) data is written to the address designated by word address (n-th address) (4) by issuing stop bit after 8bit data input, internal write to memory cell starts. (5) when internal write is started, command is not accepted for t wr (5ms at maximum). (6) using page write cycle, writing in bulk is done as foll ows: when data of more than 16 bytes is sent, the byte in excess overwrites the data already sent first. (refer to "internal address increment".) (7) as for page write command, where 2 or more bytes of data is intended to be written, after page select bit p0,p1,p2 of slave address are designat ed arbitrarily, only the value of 4 least significant bits in the address is incremented internally, so that data up to 16 addresses of memory only can be written. 2. notes on page write cycle 1 page=16bytes, but the page write cycle time is 5ms at maximum for 16byte bulk write. it does not stand 5ms at maximum 16byte=80ms(max) 3. internal address increment page write mode p1 p2 wa 7 d7 1 1 0 0 w r i t e s t a r t r / w s t o p word address data slave address p0 wa 0 d0 a c k sda line a c k ac k figure 33. byte write cycle figure 34. page write cycle for example, when it is started from address 0eh, then, increment is made as below, 0eh 0fh 00h 01h ??? please take note. 0eh ??? 0e in hexadecimal, therefore, 00001110 becomes a binary number. i w r i t e s t a r t r / w a c k s t o p word address(n) data(n) sda line a c k a c k data(n+15) a c k slave address 1 0 0 1 p0 p1 p2 w a 7 d0 d7 d0 w a 0 downloaded from: http:///
datasheet 14/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 read command 1. read cycle read cycle is when data of eeprom is read. read cycle could be random read cycle or current read cycle. random read cycle is a command to read data by designating a specif ic address, and is used generally. current read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available where and the next address data can be read in succession. (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read ad dress (n)-th, i.e., data of the (n+1)-th address is output. (3) when ack signal 'low' after d0 is detected, and stop condition is not sent from mast er (-com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where 'h' is input to ack signal after d0 and sda signal goes from l to h while scl signal is 'h' . (5) when 'h' is not input to ack signal after d0, sequential read gets in, and the next data is output. therefore, read command cycle cannot be ended. to end the read command cycle, be sure to input 'h' to ack signal after d0, and the stop condition where sda goes from l to h while scl signal is 'h'. (6) sequential read is ended by stop condition where 'h' is in put to ack signal after arbitrary d0 and sda is asserted from l to h while scl signal is 'h'. figure 35. random read cycle figure 36. current read cycle figure 37. sequential read cycle (in the case of current read cycle) s t a r t s t o p sda line a c k data(n) a c k slave address 10 0 1 p0 p1 p2 d0 d7 r / w r e a d r e a d s t a r t r / w a c k s t o p da t a ( n ) sd a line a c k a c k data ( n+x ) a c k s lav e address 10 0 1 p0 p1 p2 d0 d7 d0 d7 w r i t e s t a r t r / w ac k s t o p word address(n) sda line a c k ac k data(n) a c k slave address 10 0 1 p0 p1 p2 wa 7 a0 d0 slave address 10 0 1a1 a2 st a r t d7 r / w r e a d w a 0 downloaded from: http:///
datasheet 15/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 software reset software reset is executed to avoid malfunction after po wer on and during command input. software reset has several kinds and 3 kinds of them are shown in the figure below. (refer to figure 38-(a), figure 38-(b), and figure 38-(c).) within the dummy clock input area, the sda bus is released ('h' by pul l up) and ack output and read data '0' (both 'l' level) may be output from eeprom. therefore, if 'h' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. acknowledge polling during internal write execution, all in put commands are ignored, therefore ack is not returned. during internal automatic write execution after write cycle input, next command (slave addr ess) is sent. if the first ack signal sends back 'l', then it means end of write operation, else 'h' is returned, which m eans writing is still in progress. by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. to write continuously, w/r = 0, then to carry out current read cycle after write, slave address with w/r = 1 is sent, and if ack signal sends back 'l', then execute word address input and data output and so forth. 1 2 13 14 scl dummy clock14 start2 scl figure 38-(a). the case of dummy clock14 + start+start+ command input start command from start input. 2 1 8 9 dummy clock 9 start figure 38-(b). the case of start + dummy clock9 + start + command input start normal command normal command normal command normal command start 9 sda sda scl 1 2 3 8 9 7 figure 38-(c). start9 + command input normal command normal command sda slave address word address s t a r t first write command a c k h a c k l slave address slave address slave address data write command during internal write, ack = high is returned. after completion of internal write, ack=low is sent back, so input next word address and data in succession. t wr t wr second write command st a r t st a r t s t a r t st a r t s t o p st o p a c k h a c k h a c k l a c k l figure 39. case of continuous write by acknowledge polling downloaded from: http:///
datasheet 16/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 command cancel by start condition and stop condition during command input, by continuously inputting start condi tion and stop condition, command can be cancelled. (figure 40) however, within ack output area and during data read, sda bus may output 'l'. in this case, start condition and stop condition cannot be input, so reset is not available. therefore, execute software reset. when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. therefore, it is not possible to carry out current read cycle in succession. to carry out read cycle in succession, carry out random read cycle. scl sda 1 1 0 0 start condition stop condition figure 40. case of cancel by start, stop condition during slave address input downloaded from: http:///
datasheet 17/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 i/o peripheral circuit 1. pull-up resistance of sda terminal sda is nmos open drain, so it requires a pu ll up resistor. as for this resistance value (r pu ), select an appropriate value from microcontroller v il , i l , and v ol -i ol characteristics of this ic. if r pu is large, operating frequenc y is limited. the smaller the r pu , the larger is the supply current (read). 2. maximum value of r pu the maximum value of r pu is determined by the following factors. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2)the bus electric potential a to be determined by the input current leak total (i l ) of the device connected to the bus with output of 'h' to the sda line and r pu should sufficiently secure the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2vcc. v cc - i l r pu - 0.2 v cc R v ih ex.) vcc =3v i l =10a v ih =0.7 vcc from(2) 30 [k ] 3. minimum value of r pu the minimum value of r pu is determined by the following factors: (1)when ic outputs low, it should be satisfied that v olmax =0.4v and i olmax =3ma. (2)v olmax =0.4v should secure the input 'l' level (v il ) of microcontroller and eeprom including the recommended noise margin of 0.1vcc. v olmax v il- 0.1 v cc ex.) v cc =3v, v ol =0.4v, i ol =3ma, microcontroller, eeprom v il =0.3vcc from(1) 867[ ] and v ol =0.4 v v il =0.3 3 =0.9 v therefore, the condition (2) is satisfied. 4. pull-up resistance of scl terminal when scl control is made at the cmos output port, there is no need for a pull up resistor. but when there is a time where scl becomes 'hi-z', add a pull up resistor. as for the pull up resistor value, one of several k to several ten k is recommended in consideration of drive per formance of output port of microcontroller. figure 41. i/o circuit diagram microcontroller r pu a sda terminal i l i l bus line capacity c bus brcb008gwz-3 r pu 0.8vcc-v ih i l r pu 0.8 3-0.7 3 10 10 -6 r pu vcc-v ol r pu i ol vcc-v ol i ol r pu 3-0.4 3 10 -3 downloaded from: http:///
datasheet 18/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 cautions on microcontroller connection 1. r s in i 2 c bus, it is recommended that sda port is of open drain input/output. however, when us ing cmos input / output of tri state to sda port, insert a series resistance rs betw een the pull up resistor rpu and the sda terminal of eeprom. this is to control over current that may occur when pm os of the microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protecting the sda terminal against surge. therefore, even when sda port is open drain input/output, r s can be used. 2. maximum value of r s the maximum value of rs is determined by the following relations. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower. furthermore, ac timing shou ld be satisfied even when sda rise time is slow. (2) the bus electric potential a to be determined by r pu and r s the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin of 0.1vcc. v cc =3v v il =0.3v cc v ol =0.4v r pu =20k 3. minimum value of r s the minimum value of r s is determined by over current at bus collision. when over current flows, noises in power source line and instantaneous power failure of power source may o ccur. when allowable over current is defined as i, the following relation must be satisfied. determine the allowable current in consideration of t he impedance of power source line in set and so forth. set the over current to eeprom at 10ma or lower. ex) v cc =3v i=10ma (vcc-v ol ) r s r pu +r s r pu microcontroller r s eeprom figure 42. i/o circuit diagram figure 43. input / output collision timing a ck 'l' output of eeprom 'h' output of microcontroller over current flows to sda line by 'h' output of microcontroller and 'l' output of eeprom. scl sda microcontroller eeprom 'l'output r s r pu 'h' output over current i figure 45. i/o circuit diagram figure 44. i/o circuit diagram r pu micro controller r s eeprom i ol a bus line capacity c bus v ol v cc v il +v ol +0.1vcc v il r s r pu v il -v ol -0.1vcc 1.1vcc-v il 1.67[k ] r s 0.3 3-0.4-0.1 3 1.1 3-0.3 3 20 10 3 r s 3 10 10 -3 300[ ] vcc r s i r s vcc i downloaded from: http:///
datasheet 19/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 i/o equivalence circuit 1. input (scl) 2. input / output (sda) figure 46. input pin circuit diagram figure 47. input / output pin circuit diagram downloaded from: http:///
datasheet 20/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 power-up/down conditions at power on, the ics internal circuit may go through unstabl e low voltage area as the vcc rises, making the ics internal logic circuit not completely reset, hence, malfunction may occu r. to prevent this, the ic is equipped with por circuit and lvcc circuit. to assure the operation, obser ve the following conditions at power on. 1. set sda = 'h' and scl ='l' or 'h 2. start power source so as to satisfy the recommended conditions of t r , t off , and v bot for operating por circuit. t off t r v bot 0 v cc 3. set sda and scl so as not to become 'hi-z'. when the above conditions 1 and 2 cannot be obs erved, take the following countermeasures. (1) in the case when the above condition 1 cannot be observed such that sda becomes 'l' at power on. control scl and sda as shown below, to make scl and sda, 'h' and 'h'. (2) in the case when the above condition 2 cannot be observed. after power source becomes stable, execute software reset(page 15). (3) in the case when the above conditions 1 and 2 cannot be observed. carry out (1), and then carry out (2). low voltage malfunction prevention function lvcc circuit prevents data rewrite operation at low power and prev ents write error. at lvcc voltage (typ =1.2v) or below, data rewrite is prevented. noise countermeasures 1. bypass capacitor when noise or surge gets in the power source line, malfunct ion may occur, therefore, it is recommended to connect a bypass capacitor (0.1f) between the ics vcc and gnd. connect the capacitor as close to the ic as possible. in addition, it is also recommended to connect a bypass capacitor between the boards vcc and gnd. recommended conditions of t r , t off ,v bot t r t off v bot 10ms or below 10ms or larger 0.3v or below 100ms or below 10ms or larger 0.2v or below t low t su:dat t dh a fter vcc becomes stable scl v cc sda t su:dat a fter vcc becomes stable figure 48. rise waveform diagram figure 49. when scl= 'h' and sda= 'l' figure 50. when scl='l' and sda='l' downloaded from: http:///
datasheet 21/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 operational notes 1. described numeric values and data are design represent ative values only and the values are not guaranteed. 2. we believe that the application circuit examples in this document are recommendable. howe ver, in actual use, confirm characteristics further sufficiently. if changing the fixed num ber of external parts is desired, make your decision with sufficient margin in consideration of st atic characteristics, transient characteri stics, and fluctuations of external parts and our lsi. 3. absolute maximum ratings if the absolute maximum ratings such as supply voltage, operating temperature range and so on are exceeded, lsi may be destroyed. do not supply voltage or subject the ic to temperature exceeding the absolute maximum ratings. in the case of fear of exceeding the absolute maximum rati ngs, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding the absol ute maximum ratings should not be supplied to the lsi. 4. gnd electric potential set the voltage of gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal. 5. thermal design use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6. short between pins and mounting errors be careful when mounting the ic on printed circuit boards . the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted toget her. short circuit may be caused by conductive particles caught between the pins. 7. operating the ic in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. downloaded from: http:///
datasheet 22/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 part numbering b r c f 0 1 6 g w z - 3 e 2 revision capacity 016=16k bus type c i 2 c package gwz ucsp30l1 process code packaging and forming specification e2 : embossed tape and reel downloaded from: http:///
datasheet 23/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 physical dimensions tape and reel information i = ? g g ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin 0.840.05 0.86 0.05 0.35max 0.080.05 0.08 0.220.05 0.230.05 downloaded from: http:///
datasheet 24/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 marking diagram 1pin mark part number marking lot no. j c ucsp30l1(top view) downloaded from: http:///
datasheet 25/25 BRCF016GWZ-3 ?2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 23.sep.2015 rev.001 tsz02201-0929ag100010-1-2 revision history date revision changes 23.sep.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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